LED Process Substrate Process LED Equipment Substrate Equipment Consumables

Fine Polishing Plate back
Model:18"、24",Customization Available

【Description】 Apply onto wafers for better surface polishing compare to Copper Process                               
   
【Feature】 Excellent Plate Uniformity with excellent Heat Sink Ability
  Fast Cutting without deep scratches
  Better Surface Roughness
  Long Life Time
   
【Keyword】 精拋盤 / 精抛盘 / Fine Polishing Plate

 

 

Specification: